SemiExpo 2022 » Market Update. Edition 8
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16 April 2019

Dear partners!

Meet the eighth news industry edition of the exhibition brand SEMIEXPO RUSSIA. We have collected all the most relevant information for you and will do it regularly to ensure your growth and development in Russia and in global markets.

In the current issue:


 1.AMD to 3D stack DRAm and SARM on processors?

 AMD revealed at a recent high performance computing event that it is working on new designs that use 3D-stacked DRAM and SRAM on top of its processors to improve performance. Read more


2. See key trends driving computer vision and al in the Embeddeb Vision Alliance white paper.

The Embedded Vision Alliance announced a new white paper on the key trends driving the proliferation of vision applications and influencing the future of the industry. Read more


3. Artificial intelligence computing for Automotive 2019.

Artificial Intelligence (AI) is slowly but surely invading more and more markets, and thus the daily movements of each one. Yole Développement’s (Yole) AI Computing for Automotive 2019 report describes AI’s impact on the automotive ecosystem through autonomous cars and infotainment applications/systems. Read more


4.Hybrid bonding, an enabling technology, from CMOS Image Sensors to Memory & High-Performance Computing – Interview of Xperi.

With higher performance, lower consumption and smaller footprint, stacking technology is becoming standard for high-end and imaging applications. Mario Ibrahim, Advanced packaging, technology & market analyst at Yole Développement (Yole) and author of the report 2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates 2019, had the opportunity to discuss with Paul Enquist, VP 3D R&D at Xperi Corporation. Read more